MEMS Pressure Sensor Die for Catheters

Users looking for the smallest possible MEMS pressure sensor die for their medical catheter application can opt for NovaSensor’s range for the perfect fit. With products ranging in size, pressure range, and ease of integration, NovaSensor is sure to have the sensor solution you are looking for.

NovaSensor not only has in-house wafer fabrication, but also the manufacturing infrastructure and technical know-how to design, develop, testand modify sensors right within its own facilities. NovaSensor provides the smallest-ever catheter die solutions and capabilities in the industry along with superior performance.

The use of ultra-small MEMS pressure die presents ultra-small assembly and handling difficulties. Hence, NovaSensor provides evaluation kits and die that include wire sub-assemblies. This eliminates the manufacturing difficulty and makes it very simple to connect to the die, thereby offering the output signal in a standard usable form.

For customers who find it difficult to choose a die that precisely fits their application, NovaSensor offers the engineering expertise to design a custom die to meet their needs.

Catheter Applications

Cardiovascular

Ablation

Urinary

Urological/rectal

Intracranial

Image Credit:Amphenol Advanced Sensors

NovaSensor MEMS Catheter Pressure Die Products

Source:Amphenol Advanced Sensors

Parameter	Units	P162	P330	P2490	P330B / P330F
Size(L x W x T)	μm	1150 x 725 x 180	900 x 330 x 180	800 x 240 x 90	900 x 330 x 120
Circuit		Two piezoresistors (half-bridge).Need to add two resistors to complete the bridge
Excitation	V	1…6 DC, 10 V DC maximum
Pressure Range	mmHg	0-300differential	450-1050absolute	450-1050absolute	450-1050absolute
Bridge resistance 1	Ohm	800	3200	2000	2000
Sensitivity 1	μV/V/mmHg	18	10	8	15 / 6
Nonlinearity*	mmHg	<1	<1	<1	<1
Offset at 1 bar 1	mV/V	1	9	within±3	within±3
TC Offset	μV/V/C	±40	±30	±20	±20
TCSensitivity 1	%/C	–0.12	–0.2	–0.2	–0.2
TC Resistance 1	%/C	0.12	0.10	0.13	0.13
Operating temp. 2	C	15…45
Proof pressure	mmHg	2000	2700	3000	3000 / 30000
Wire connection		Wire bonding (WB)		Soldering (solder bumps on die)
Samples		Available	Available	Available	Available
Product status		Released	Released	In development	Released

All products have gold metallization.1. Typical value.2. Range can be extended after additional validation.

Sub-Assemblies and Eval Kits

P330W

P330W-EVAL-A3

P330W-EVAL-D3

Image Credit:Amphenol Advanced Sensors

Image Credit:Amphenol Advanced Sensors