NXP Semiconductors
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Dan Young, president and founder of Thermal Press International, Inc. started Young Technologies in the heart of Silicon Valley, California in the early 1980's building fixtures, designing injection molds, and contract manufacturing for the high-tech and plastics industries.
Rapidly outgrowing the original facility, Young Technology moved to Fremont, CA when a telecommunications customer approached with a unique problem. It involved staking a large ESD shield into a communication device plastic housing. The customer was struggling with the limitations to ultrasonic welding of the shielding into the housing, due to the tight physical part constraints and related issues of the sonics damaging the electronics. It was at this time that Young Technology created and built the original Thermal Press machines for plastics assembly.
Prior to this design, there was not a Thermal Press machine built for heat staking or even the name. From these early machines, arose the high-capacity systems engineered to incorporate Bosch pallet transfer lines to increase throughput. At the same time, Young Technology developed additional Thermal Press machines with CCD vision systems for speciality heat sealing applications, where precisely controlled pressure and temperature were required to assemble heat seal connectors to front panel displays, LCDs, and PCBs.
In 1996 an additional facility was opened in Livermore, CA. At this time the company name was changed to Thermal Press International, Inc. reflecting the original equipment line that we were manufacturing for manufacturing and production facility worldwide.
Over the years as various industries discovered the advantages of heat staking and heat sealing process for their thermoplastic assemblies; Thermal Presses are now found in use for plastic bonding, heat sealing of films, foils, medical ports, membranes, welding, joining of assemblies, hot knife degating and cutting, insertion of threaded metal inserts, pressure assembly, fusing of various plastics and other materials, insertion, plastic adhesive bonding with activated adhesives, heat seal connectors for LCD/PCB applications, and more.
The following are examples of some of the industries served by Thermal Press machines and systems: automotive, industrial, medical device manufacturing, consumer electronics, appliance, fixtures, aerospace, telecommunications, Food and Drug Storage, memory module units, sporting equipment, semiconductor, PCB and LCD connectors, and more. Just about every industry uses some form of plastic or thermal assemblies processes.
A few of the products assembled with this process include: heat staking automotive electronics and tail lamps, medical devices, insulin pumps, glucose meters, telecommunication devices and Internet phone, computer equipment, disk drives, memory modules, SIMM cards, PCMCIA card modules, and micro miniature assemblies. Just about every conceivable item can take advantage of Heat Staking and Heat Sealing assembling technologies.
Even though Dan Young is no longer with Thermal Press International as of early 2000's, Thermal Press machines are still manufactured and installed all over the world. Their reliability and repeatability are world renown. While there might be imitators of our Thermal Press designs, there is only one you can Trust, Thermal Press International.
Primary Activity
Material Manufacturer
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